Waterjet Cleaning of Metals - Clean to Bare Substrate

This SSPC/NACE joint standard defines the Clean to Bare Substrate (WJ-1) degree of surface cleanliness of coated or uncoated metallic substrates achieved by the use of waterjet cleaning prior to the application of a protective coating or lining. Waterjet cleaning is the use of pressurized surface preparation water for removing coatings and other materials, including hazardous materials, from a substrate to achieve a defined degree of surface cleanliness. Waterjet cleaning includes various methods such as low-pressure water cleaning (LP WC), high-pressure water cleaning (HP WC), high-pressure waterjetting (HP WJ), and ultrahigh-pressure waterjetting (UHP WJ).