This study examines the effect of pretreatment and alloy aging on the rate of scribe-creep caused by under-paint corrosion on AA2024 (T3, T3 + 3 hrs @ 190°C, T3 + 12 hrs @ 190°C, T3 + 30 hrs @ 190°C, and T3 + 240 hrs @ 190°C). Scribe-creep experiments were conducted in humid air at 80% relative humidity and 25°C as well as 40°C temperatures. Scribe-creep was observed to be enhanced by scribe-creep test temperature, artificial aging, and by pretreatments which affects the amount of replated Cu. Experiments show that the Cu content of the alloy and pretreatment strongly influence scribe creep. The effect of each of these is traced to either the ability of each condition to supply Cu for replating or anodic dissolution resistance. When Cu is eliminated as an alloying element, or minimized by HNO3 treatment, scribe-creep corrosion rates were lowered.

Subject
Coatings, Materials, Corrosion rate, Sodium chloride, Micrography, Voltammetry, Copper alloys, Pretreatment, Pitting, Oxygen, Copper, Risk reduction, Aging
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2004
Association for Materials Protection and Performance (AMPP)
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