Different aqueous solutions were examined highlighting the corrosion potential of commonly found metals and metal alloys present in computer components. Corrosion as a function of pH is identified and optimized for Cu, CoFe, and NiMn Ion Beam Deposited (IBD) films by Tafel plots. References to early computer field failures are presented that spotlight galvanic corrosion as a substantial cause for failed components. Further corrosion evaluation identifies galvanic corrosion effects between combinations of NiFe, NiMn, Cu, CoFe, and Ru films where corrosion currents range from 20 to over 100 μAmps. Surface area ratios tested were 1:1, 1:10, and 1:20 with the surprising combinations of Ru:CoFe producing the greatest corrosion rates of 100+ Å/min. (1:20) or as much as 7 μA/cm2 (1:10) for CoFe. These results highlight the critical aspects affecting the proper working order of electrical components that manufacturers and end users all need to consider.

Subject
Circuits, Films, Corrosion failures, Materials, Corrosion currents, Corrosion rate, Industries, Acidity, Sodium chloride solution, Metals, Gold, Copper, Galvanic corrosion
Keywords:
Galvanic corrosion, atmospheric corrosion, computers, electrical connectors, circuit boards, salt spray, short circuits, Electromotive Series, F-16, potentiodynamic
© 2000 Association for Materials Protection and Performance (AMPP). All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise) without the prior written permission of AMPP. Positions and opinions advanced in this work are those of the author(s) and not necessarily those of AMPP. Responsibility for the content of the work lies solely with the author(s).
2000
Association for Materials Protection and Performance (AMPP)
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