Numerical corrosion analysis capability is extended to applications of thin electrolytes (atmospheric condensates) on multimetallic and multipotential electronic components. Dissolution or electrodeposition rates are predicted for the metal components on printed wiring boards. Guidelines for printed wiring board spatial design are projected from the results of these analyses.

Subject
Anode potential, Finite element analysis, Geometry, Anode surfaces, Polarization curves, Current densities, Copper, Elements, Electrodes, Conductivity, Electrolytes, Electrode potential, Anodes
© 1988 Association for Materials Protection and Performance (AMPP). All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise) without the prior written permission of AMPP. Positions and opinions advanced in this work are those of the author(s) and not necessarily those of AMPP. Responsibility for the content of the work lies solely with the author(s).
1988
Association for Materials Protection and Performance (AMPP)
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