The objective of the study was to compare the performance and moisture resistance of two groups of polymer sealed and two groups of transfer molded hybrid circuits to metal packaged, solder sealed hybrids of the same circuit type subjected to the same tests. Additionally, the performance of moisture sensors assembled inside the hybrids was also investigated.
© 1979 Association for Materials Protection and Performance (AMPP). All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise) without the prior written permission of AMPP. Positions and opinions advanced in this work are those of the author(s) and not necessarily those of AMPP. Responsibility for the content of the work lies solely with the author(s).
1979
Association for Materials Protection and Performance (AMPP)
You do not currently have access to this content.
