The surface treatment of copper prior to adhesive bonding commonly involves oxidation in alkaline chlorite* solution at ~95°C1 . The characteristic morphology of the oxide formed can be correlated with its favorable adhesive bonding characteristics2 . Typically, coulometric reduction3  of the film recovers 50% or less of the total oxidized copper, the balance being lost as soluble corrosion products.

Subject
Electric current, Voltage, Adhesives, Substrates, Oxides, Constants, Oxide surfaces, Film formation, Film thickness, Anodic current, Copper, Electrodes, Counter electrodes
© 1973 Association for Materials Protection and Performance (AMPP). All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise) without the prior written permission of AMPP. Positions and opinions advanced in this work are those of the author(s) and not necessarily those of AMPP. Responsibility for the content of the work lies solely with the author(s).
1973
Association for Materials Protection and Performance (AMPP)
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