This paper illustrates some of the modes by which electrodeposits fail, and shows the usefulness of microscopic examination in determining the causes of failure. It is shown that failures can result from errors at any of a number of steps in what is often a very involved processing sequence.

Subject
Plating, Substrates, Metal surfaces, Wiring, Substrate surfaces, Mechanical failure, Fingers, Plastics, Gold, Copper, Nickel, Blistering, Voids
© 1989 Association for Materials Protection and Performance (AMPP). All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise) without the prior written permission of AMPP. Positions and opinions advanced in this work are those of the author(s) and not necessarily those of AMPP. Responsibility for the content of the work lies solely with the author(s).
1989
Association for Materials Protection and Performance (AMPP)
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