The interaction of the environment with electronic equipment and device surfaces will be discussed in the context of the arrival rate and accumulation of corrosive substances at surfaces. These are controlled by: (1) the net influx of pollutants from the outdoor environment; (2) the internal generation of corrosive species; (3) the deposition rate to surfaces; and (4) the reactivity of these substances on and with the surfaces. A quantitative methodology for predicting indoor accumulation rates of ionic substances from outdoor concentrations will be illustrated. The methodology is based on studies at electronic equipment rooms across the United States but its usefulness is not limited to these environments. It can also be applied to surfaces of equipment being manufactured in factory environments, and to surfaces of integrated circuits as they are being processed in a clean room environment.

Subject
Fluxes, Manufacturing, Corrosion rate, Predicted corrosion rate, Metal surfaces, Sulfates, Probability, Pollutants, Deposition rate, Equipment, Sulfur dioxide, Gases, Chlorides
© 1989 Association for Materials Protection and Performance (AMPP). All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise) without the prior written permission of AMPP. Positions and opinions advanced in this work are those of the author(s) and not necessarily those of AMPP. Responsibility for the content of the work lies solely with the author(s).
1989
Association for Materials Protection and Performance (AMPP)
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