The influence of temperature on dissolution and passivation of copper in solutions containing carbonate (CO32–)-bicarbonate (HCO3) ions at pH 8.9 to 10.5 was studied in the range from 5°C to 65°C. The strongest effect of temperature on corrosion behavior of copper was in the potential regions corresponding to electroformation of cupric oxide (CuO) and cupric hydroxide (Cu[OH]2) species as well as basic copper carbonates (CuCO3). Effects of hydrodynamic conditions and electrolyte composition on base metal electrodissolution and prepassive layer dissolution processes were considered. The low activation energy obtained for electroformation of CuO and Cu(OH)2 layers in still solutions was compatible with a poorly structured thin passive layer, with the copper electro-dissolution process taking place through a prepassive layer. Solution stirring and high temperature were shown to improve protective characteristics of the passivating layer.

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