The stress corrosion cracking (SCC) characteristics of a variety of copper-base alloys has been investigated in four different ammoniacal solutions in the range of pH values from 4 to 14. Failure times were correlated to free corrosion potentials and tarnishing behavior. In each solution, failure times decreased with more active corrosion potentials and faster tarnishing rates. No difference in behavior was found between the alloys that crack transgranularly and those that crack intergranularly. Parallel markings, similar to previously reported crack arrest markings on transgranular fracture surfaces, have even been found on intergranular fracture surfaces. The results imply that stress corrosion of copper alloys is controlled by anodic crack tip dissolution.

Subject
Intergranular stress corrosion cracking, Fracture surfaces, Dissolution, Transgranular stress corrosion cracking, Corrosion cracking, Copper alloys, Intergranular cracking, Mechanical failure, Film formation, Alloys, Tarnish, Corrosion potential, Stress corrosion cracking
National Association of Corrosion Engineers
1987
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