Describes a simple screening test similar to copper ion displacement test which has been devised to screen corrosion inhibitors to be used in the inhibitor squeeze process. This copper ion test evaluates durability of protective inhibitor films formed by relatively high inhibitor concentrations rather than the usual test’s determinations at low concentrations. Discusses effect of inhibitor concentrations, adsorption time, adsorption temperature, adsorption from various solvents and coupon surface preparation on film persistence of chemical compounds considered to have inhibiting properties. Evaluation is based on time required for copper to form on coupon. 5.8.4

Subject
Chemical compounds, Inhibitor films, Metal coupons, Kerosene, Iron, Solvents, Copper sulfate, Chemical inhibition, Amines, Film formation, Corrosion inhibitors, Oil, Copper
Copyright 1959 by the National Association of Corrosion Engineers.
1959
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